Intel to Build Test Chips Using New Manufacturing Process
Intel’s contract manufacturing customers planned to build test chips for the company's forthcoming advanced manufacturing process that is currently still in development.
The troubled chip manufacturer revealed that it had garnered interest from clients during its Direct Connect conference regarding its foundry or contract chip business. Intel's efforts to establish a foundry division have encountered challenges, but the ultimate aim has been to compete with TSMC.
After assuming the role of CEO in March, Lip-Bu Tan pledged to transform Intel and, during his initial public address, urged the company's clients to provide brutally honest feedback. As part of his strategy to revamp Intel, Tan intends to overhaul the company’s foundry operations.
The manufacturing process currently in development, referred to as 14A, was set to introduce a novel type of advanced chipmaking equipment called a high-NA EUV machine. Additionally, the 14A process incorporates a new technology for power delivery.
Intel has provided an initial version of the digital design kit essential for successfully converting a chip design into functioning silicon.
Usually, chip manufacturers create test chips to assess a new manufacturing process before committing to a full design, which involves significantly higher costs and risks.
Broadcom and Nvidia have conducted tests using Intel's existing advanced manufacturing process known as 18A.
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Intel confirmed its plans to accelerate the 18A process to high-volume production this year. The company aims to start manufacturing chips using 18A at its research and development facility located near Hillsboro, Oregon. According to Intel, its factories in Arizona will also increase production this year.