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IN-SPACe Enables the Transfer of Five Technologies Created by ISRO

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India's space sector promoter IN-SPACe announced that it has enabled the transfer of five technologies created by ISRO to Indian firms, potentially decreasing the nation's reliance on imports in those areas.

The tripartite agreements were executed among NewSpace India Limited (NSIL), the beneficiary industries, and the Indian National Space Promotion and Authorization Centre (IN-SPACe) at its main office in Ahmedabad.

According to an IN-SPACe statement, the transfers focus on promoting commercialization, enhancing self-sufficiency, decreasing imports, and facilitating broader uses of space technologies in fields like automotive, biomedical, and industrial manufacturing.

One technology, the Low Temperature Co-Fired Ceramic (LTCC) Multi-Chip Module created by SAC, facilitates the combination of several semiconductor chips into one compact unit.

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Voltix Semicon Pvt Ltd, based in Pune, has obtained this for biomedical applications, specifically for RT-PCR kits that demand high-volume manufacturing.

Voltix presently relies on imports for this technology, and the transfer of technology (ToT) will improve domestic capacity and independence.

 

Crest Speciality Resins Pvt Ltd, Ahmedabad, has acquired a room-temperature curable adhesive, RTV Silicone Single-Part Adhesive (SILCEM R9), developed by VSSC, for use in solar panel bonding.

Currently, this adhesive is brought in from abroad, and the ToT will guarantee local supply, lessen reliance on imports, and enhance domestic production.

"These transfers emphasize the increasing competence and assurance of Indian industry." "According to Pawan Goenka, Chairman of IN-SPACe, certain technologies will replace imports directly, while others will enable applications far beyond just the space industry."

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Azista Composites Pvt Ltd, Hyderabad received the technology for manufacturing Film Adhesives EFA 1753 and EFA 1752 developed by VSSC.

Ananth Technologies received the technology for the 30W HMC DC-DC Converter developed by URSC, while Pushpak Aerospace received the technology for anodization of 3D-printed Al-10Si-Mg alloy developed by URSC.

"With today's five Technology Transfer Agreements (TTAs), the total number of TTAs executed with industries has reached 98," Rajeev Jyoti, Director, Technical Directorate, IN-SPACe, said. 

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